CMP Pad Conditioning: Chemical Mechanical Planarization (CMP) is the enabling technology for polishing smooth and flat surfaces required for manufacturing many electronic materials such as ULSI and DRAM. Diamond pad conditioner is the enabling tool for CMP. During the CMP process, the wafer surface is pressed against a rotating pad. The polishing is accomplished by feeding the pad top with slurry that contains submicron abrasives and reactive chemicals. The diamond pad conditioner is indispensable because it can sustain the polishing process by removing cut debris and restore the pad texture. Pad conditioning is crucial to ensure low defectivity and proper uniformity across the wafer; Kinik is presenting a series of papers at VMIC addressing the use of fixed pattern diamond disks in CMP pad conditioning...
Come See Kinik at VMIC 2004, presenting the following whitepapers in poster format:
Abstracts in PDF Format:
Read more about Kinik USA DiaGrid Pad Conditioners here
Samples Available: For diamond disk samples or information about Kinik-USA and its product lines, please fill out our information request form.
